High Pressure Accelerated Aging Test Chamber is designed to test products and materials in harsh temperatures, saturated humidity (100% R.H. [saturated water vapor]) and pressure environments. This high humidity resistance test equipment evaluates the absorption rate of printed circuit boards (PCB or FPC), moisture resistance of semiconductor packaging, circuit break caused by corrosion in dynamic metallization areas, and short circuits caused by contamination between package pins.
| Parameter | Specification |
|---|---|
| Temperature Range | 100°C ~ +132°C |
| Saturated-Steam Temperature | 100°C ~ +143°C |
| Pressure Range | 0.2~2kg/cm² (0.05~0.196MPa) | 0.2~3kg/cm² (0.05~0.294MPa) |
| Pressurization Time | Approximately 45min | Approximately 55min |
| Temperature Uniformity | <±0.5°C |
| Temperature Fluctuation | ≤±0.5°C |
| Humidity Range | 100% R.H (saturated-steam humidity) |
| Controller | Button or LCD controller (optional) |
| Resolution | Temperature: 0.01°C, Humidity: 0.1% RH, Pressure: 0.1kg/cm², Voltage: 0.01DCV |
| Temperature Sensor | PT-100 ohmΩ |
| External Material | SUS 304 with Painting coating |
| Internal Material | SUS 304 with Glass Wool |
| BIAS Terminal | Optional (additional cost - contact OTS) |
| Power | 3 Phase 380V 50Hz / Customized |
| Safety System | Sensor protection; High temp protection; High pressure protection; Voltage overload; Voltage monitoring; Manual adding water; Automatic depressurize and automatic water withdraw when machine in fault; Fault code displays; Fault record; Grounding wire leakage; Motor overload protection |